A lead frame for use in the manufacture of electronic components of the Quad Flat Pack - No Lead Package (QFN) type comprises an array of sites 11 for receiving respective electronic component devices, a plurality of rails 12 arranged in a grid with each site 11 being disposed in respective spaces formed within the grid. Each rail 12 within the grid carries oppositely-directed lead fingers 14 for respective adjacent sites. A further rail extends around the periphery of the array 15 and carries inwardly directed lead fingers 14 for the peripheral sites 11 as well as outwardly directed dummy lead fingers 16. The symmetrical shape and configuration of the terminals 14 and dummy terminals 16 on the peripheral rails 15 is identical to the shape and configuration of the terminals 14 on parallel rails 12 within the array and thus any wire-bonding problems associated with a difference between the resilience and thermal/electrical characteristics of the supporting structure of terminals along the outer side edges of the outer sites of the array and those of the terminals along respective edges of sites within the array are avoided.
展开▼
