Lead Free Solder for Flip ChipZhenwei Hou & R. Wayne Johnson Laboratory for Electronics Assembly & Packaging – Auburn University162 Broun Hall, ECE Dept.Auburn, AL 36489 USA334-844-1880johnson@eng.auburn.eduErin Yaeger, Mark Konarski & Larry CraneLoctite Corporation1001 Trout Brook CrossingRocky Hill, CT 06067 USA860-571-2599Larry_Crane@loctite.comAbstractThe electronics industry is moving to replace lead in electronic assemblies. The driving factors are potential legislation, primarily in Europe, and ...